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| ZMD-Standard January 2005 Package SOP8 (150 mil) MDS 726 Supersedes Edition 11.95 Dimensions in millimetres Based on IEC 191-2Q: Type 076E35 B 1 Dimensions X A2 A View X k x 45 b 0,1 0,2 M A1 8 1 Z e D Dimensions of Sub-Group B1 Amax bPmin bPmax enom HEmin HEmax LPmin Zmax 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,3 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends 1,95 0,35 0,49 1,27 5,80 6,30 0,40 0,635 HE E Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* Emin* Emax* kmin min max 1,55 0,10 0,30 1,40 1,80 0,15 0,25 4,80 5,00 3,80 4,00 0,33 0 8 * without mold-flash Zentrum Mikroelektronik Dresden Editor: signature by Schoder Check: signature by Marx Date: 06.01.2005 Quality: signature by Tina Kochan Doc-No. QS-000726-HD-03 Als Betriebsgeheimnis anvertraut. Alle Rechte vorbehalten. Proprietary data, company confidential. All rights reserved. c LP |
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